Component Search Engine - Free access to schematic symbols, PCB footprints and 3D models

2356320-5 - TE Connectivity

Description: Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 74 | Number of Rows 2 | Contact Features: Contact Underplating Material Nickel | Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .762 MICM | Contact Mating Area Plating Material Gold | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch)

ECAD model is currently unavailable for this part

Note! To download footprints and symbols, use the build and request forms below

Build this Model Build

Package Category Launch Build Wizard

Request this Model (48 hours)

2356320-5 Overview

No models are available for download for 2356320-5. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.

To find more CAD model downloads similar to this part, try a partial part number search, like 23563, or try a keyword search, such as Telecom and Datacom Connectors

Parts related to 2356320-5

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →

2356320-5 - TE Connectivity

Build this Model Build

Request this Model (48 hours)

Datasheet PDF Preview

2356320-5 Overview

Parts related to 2356320-5

Select Package Category

Quick Jump

Package Categories

Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

Moulded Non-Polarised

Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

Small Outline Diode

SON

SOT

Transistor Outline, Vertical

Other