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2384218-1 - TE Connectivity

Description: Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 168 | Contact Features: Contact Mating Area Plating Material Thickness 3 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .076 MICM | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 1.1 AMP | Housing Features: Centerline (Pitch) .026 INCH | Centerline (Pitc

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2384218-1 Overview

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