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2406842-1 - TE Connectivity

Description: Body Features: Body Plating Material Gold | Body Underplating Material Copper | Body Material Beryllium Copper | Body Material Finish Plated | Configuration Features: Number of Positions 1 | PCB Mount Orientation Vertical | Number of Coaxial Contacts 1 | Contact Features: RF Connector Center Contact Plating Material Gold | RF Connector Center Contact Material Beryllium Copper | Electrical Characteristics: Impedance 50 OHM | Mechanical Attachment: RF Connector Coupling Mechanism Push-On | RF Contact Captivat

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2406842-1 - TE Connectivity

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

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Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

Small Outline Diode

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Transistor Outline, Vertical

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