5-5223955-4 - TE Connectivity
Description: Configuration Features: Board-to-Board Configuration Perpendicular | Board-to-Board Configuration Parallel | Number of Power Positions 3 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 3 | Contact Features: Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 16 AMP | Contact Type Receptacle | Contact Retention Within Housing With | Contact Mating Area Platin
ECAD model is currently unavailable for this part
