50225C - Murata Electronics

50225C Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the 50225C?
  The recommended land pattern for the 50225C is a rectangular pad with a size of 2.5mm x 1.5mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component centerline, and the solder resist should be 0.5mm from the component body.
• How do I handle the 50225C's sensitivity to moisture?
  To handle the 50225C's sensitivity to moisture, it is recommended to store the components in a dry environment (less than 20% RH) and to bake the components at 125°C for 24 hours before reflow soldering. Additionally, the components should be soldered within 168 hours of opening the package.
• What is the maximum reflow temperature for the 50225C?
  The maximum reflow temperature for the 50225C is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds. It is recommended to follow the reflow profile recommended by Murata Manufacturing Co Ltd.
• Can the 50225C be used in high-vibration applications?
  Yes, the 50225C is designed to withstand high-vibration applications. However, it is recommended to follow the vibration testing guidelines provided by Murata Manufacturing Co Ltd to ensure the component's reliability.
• What is the recommended cleaning process for the 50225C?
  The recommended cleaning process for the 50225C involves using a mild detergent and deionized water. Ultrasonic cleaning is not recommended, and the use of chlorinated or fluorinated solvents should be avoided.