556882-4 - TE Connectivity
Description: Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 4 | Number of Signal Positions 0 | Number of Positions 4 | Contact Features: Contact Layout Inline | Contact Mating Area Plating Material Thickness 3.81 MICM | Contact Type Tab | Contact Mating Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Tin | Contact Shape & Form Dual Beam | Contact Retention Within Housing With | Contact Base Material Copper Alloy | Contact Current
ECAD model is currently unavailable for this part
