55688 Model Download Search Results
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556881-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Signal Positions 0 | Number of Positions 2 | Number of Rows 1 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 35 AMP | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 MICM | Contact Shape & Form Dual Beam | Contact Rete | Other | 556881-2 |
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556881-5
TE Connectivity
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1 | Rectangular Power Connectors, Connector Assembly, Receptacle, Wire-to-Board, 5 Position, 11.18 mm [.44 in] Centerline, Printed Circuit Board, UL 94V-0 | Other | 556881-5 |
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556882-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Signal Positions 0 | Number of Positions 3 | Number of Power Positions 3 | Number of Rows 1 | Contact Features: Contact Type Tab | Contact Base Material Copper Alloy | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 3.81 MICM | Contact Current Rating (Max) 35 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Mater | Other | 556882-3 |
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1955688
Phoenix Contact
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1 | CCV 2,5/ 7-GF-5,08 P26THR - PCB headers, nominal cross section: 2.5 mm2, color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 7, number of rows: 1, number of positions: 7, number of connections: 7, product range: CCV 2,5/..-GF, pitch: 5.08 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, P | Other | 1955688 |
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556881-7
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Signal Positions 0 | Number of Power Positions 7 | Number of Rows 1 | Number of Positions 7 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Contact Retention Within Housing With | Contact Current Rating (Max) 35 AMP | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 3.81 MICM | Contact Shape & Form Dual Beam | Contact Type Tab | PCB Contact Ter | 556881-7 |
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556880-1
TE Connectivity
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1 | Connector Accessory, Contact, Copper Alloy | 556880-1 |
0
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556881-4
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | Number of Signal Positions 0 | Number of Power Positions 4 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 35 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 3.81 MIC | 556881-4 |
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556881-6
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 6 | PCB Mount Orientation Vertical | Number of Power Positions 6 | Number of Signal Positions 0 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Tin | Contact Shape & Form Dual Beam | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 35 AMP | Contact Mating Area Plating Material Thickness 150 MICIN | | 556881-6 |
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556880-2
TE Connectivity
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1 | Connector Accessory, Copper Alloy | 556880-2 |
0
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556881-8
TE Connectivity
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1 | Configuration Features: Number of Power Positions 8 | Number of Positions 8 | Number of Signal Positions 0 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Tin | Contact Base Material Copper Alloy | Contact Layout Inline | Contact Current Rating (Max) 35 AMP | Contact Mating Area Plating Material Thickness 150 MICIN | Contact Retention Within Housing With | Contact Shape & Form Dual Beam | Contact Type Tab | Contact Mating Area Plating Material Thi | 556881-8 |
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556882-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Signal Positions 0 | Number of Rows 1 | Number of Positions 6 | PCB Mount Orientation Right Angle | Contact Features: Contact Type Tab | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Shape & Form Dual Beam | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 150 MICIN | PCB Contact Term | 556882-6 |
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556882-8
TE Connectivity
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1 | Configuration Features: Number of Signal Positions 0 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 8 | Number of Power Positions 8 | Contact Features: Contact Layout Inline | Contact Shape & Form Dual Beam | Contact Current Rating (Max) 35 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Base Material Copper Alloy | Contact Type Tab | Contact Retentio | 556882-8 |
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556882-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Signal Positions 0 | Number of Rows 1 | Number of Positions 2 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Shape & Form Dual Beam | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Hous | 556882-2 |
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556883-1
TE Connectivity
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1 | Connector Accessory | 556883-1 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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556882-7
TE Connectivity
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1 | Configuration Features: Number of Positions 7 | PCB Mount Orientation Right Angle | Number of Power Positions 7 | Number of Rows 1 | Number of Signal Positions 0 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Retention Within Housing With | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | 556882-7 |
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556883-2
TE Connectivity
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1 | Connector Accessory | 556883-2 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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556881-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 3 | Number of Signal Positions 0 | Number of Positions 3 | Contact Features: Contact Retention Within Housing With | Contact Shape & Form Dual Beam | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 35 AMP | Contact Mating Area Plating Material Thickness 3.81 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | PCB Contact Termina | 556881-3 |
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556882-4
TE Connectivity
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1 | Rectangular Power Connector, 4 Contact(s), Male, Solder Terminal, Receptacle | 556882-4 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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556882-5
TE Connectivity
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1 | Configuration Features: Number of Power Positions 5 | Number of Signal Positions 0 | PCB Mount Orientation Right Angle | Number of Positions 5 | Number of Rows 1 | Contact Features: Contact Retention Within Housing With | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 3.81 MICM | PCB Contact Termination Area Plating Material Tin | Contact Type Tab | Contact Shape & Form Dua | 556882-5 |
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345-058-556-888
EDAC Inc
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1 | Card Edge Connector, 58 Contact(s), 2 Row(s), Female, Right Angle, 0.1 inch Pitch, Surface Mount Terminal, Guide Set, Green Insulator | 345-058-556-888 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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345-044-556-888
EDAC Inc
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1 | Card Edge Connector, 44 Contact(s), 2 Row(s), Female, Right Angle, 0.1 inch Pitch, Surface Mount Terminal, Guide Set, Green Insulator | 345-044-556-888 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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395-032-556-888
EDAC Inc
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1 | Card Edge Connector, 32 Contact(s), 2 Row(s), Female, Right Angle, 0.1 inch Pitch, Surface Mount Terminal, Guide Set, Black Insulator | 395-032-556-888 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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934055688215
NXP Semiconductors
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1 | Pin Diode, 175V V(BR), Silicon, TO-236AB | 934055688215 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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395-090-556-888
EDAC Inc
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1 | Card Edge Connector, 90 Contact(s), 2 Row(s), Female, Right Angle, 0.1 inch Pitch, Surface Mount Terminal, Guide Set, Black Insulator | 395-090-556-888 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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395-080-556-888
EDAC Inc
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1 | Card Edge Connector, 80 Contact(s), 2 Row(s), Female, Right Angle, 0.1 inch Pitch, Surface Mount Terminal, Guide Set, Black Insulator | 395-080-556-888 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/005/568/812/556881-2-t1.jpg/jcr:content/renditions/product-details.png","https://www.te.com/content/dam/te-com/catalog/part/005/568/812/556881-2-t1.jpg/jcr:content/renditions/product-details.png",null])
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