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557GI-08LF - Renesas Electronics

Description: The 557-08 is a 2:1 multiplexer chip that allows the user to select one of the two HCSL (Host Clock Signal Level) input pairs and fans out to one pair of differential HCSL or LVDS outputs. This chip is suited especially for PCI-Express applications, where there is a need to select the PCI-Express clock either locally from the PCI-E card or from the motherboard.

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557GI-08LF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 16-pin TSSOP.-3
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557GI-08LF - Renesas Electronics  - 3D model - Small Outline Packages - 16-pin TSSOP.-3
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557GI-08LF Details

  • Manufacturer Part Number:

    557GI-08LF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    PGG16

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • JESD-609 Code:

    e3

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Terminal Finish:

    Tin (Sn)

557GI-08LF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • The power-up sequence is critical for the 557GI-08LF. Renesas recommends powering up the VCC pin first, followed by the VDD pin, and then the input signals. A slow power-up ramp (typically 1-2 ms) is also recommended to prevent latch-up and ensure reliable operation.
  • Although the datasheet specifies the recommended operating conditions, it's essential to note that the maximum allowed voltage on the input pins is typically 4.5V to prevent damage to the device. Exceeding this voltage may cause permanent damage or affect the device's reliability.
  • To ensure EMC, Renesas recommends following proper PCB design practices, such as using a solid ground plane, minimizing signal loop areas, and using shielding or filtering components as necessary. Additionally, the device's built-in EMI filters and noise reduction features can be enabled to improve EMC performance.
  • While the datasheet specifies the recommended operating temperature range, it's essential to note that the device can operate reliably up to 125°C (junction temperature) with proper thermal management. However, the device's performance and reliability may degrade above 85°C (ambient temperature).

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557GI-08LF Overview

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