Part Image

570BILFT - Renesas Electronics

Description: The IDT570 is a high-performance Zero Delay Buffer (ZDB) which integrates IDT's proprietary analog/digital Phase Locked Loop (PLL) techniques. The A version is recommended for 5 V designs and the B version for 3.3 V designs. The chip is part of IDT's ClockBlocks™ family, and was designed as a performance upgrade to meet today's higher speed and lower voltage requirements. The zero delay feature means that the rising edge of the input clock aligns with the rising edges of both output clocks, giving the appea

Download 570BILFT Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
570BILFT - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8
click to zoom
3D Models
570BILFT - Renesas Electronics  - 3D model - Small Outline Packages - SOIC-8
click to zoom

570BILFT Details

  • Manufacturer Part Number:

    570BILFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Manufacturer Package Code:

    DCG8

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    570

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.175 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • fmax-Min:

    170 MHz

570BILFT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated thermal layer and a thermal via array under the package is recommended for optimal thermal performance. Additionally, a minimum of 2 oz copper thickness and a thermal relief pattern around the package can help reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider using a heat sink or fan for cooling. Additionally, ensure that the device is operated within the specified temperature range and that the junction temperature is kept below the maximum rating.
  • Critical timing parameters include clock frequency, clock-to-output delay, and output hold time. To ensure signal integrity, use a high-quality PCB with controlled impedance, minimize signal routing distances, and use signal termination resistors as needed. Additionally, consider using a signal integrity analysis tool to simulate and optimize signal performance.
  • Implement power sequencing by ensuring that the core voltage is applied before the I/O voltage, and that the voltage regulator is stable before enabling the device. Use a suitable voltage regulator module (VRM) or a low-dropout regulator (LDO) to regulate the voltage supply, and consider using a power management IC (PMIC) for more complex power management requirements.
  • Implement ESD protection using TVS diodes or ESD protection arrays on the I/O lines, and consider using a latch-up prevention circuit or a power-on reset (POR) circuit to prevent latch-up conditions. Additionally, follow proper PCB design guidelines for ESD protection and latch-up prevention.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

570BILFT Overview

Use the download button to access the 570BILFT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 570BI, or try a keyword search, such as Clock Drivers

Parts related to 570BILFT

Showing 0 results

570BILFT Alternates

Showing results

Image Part Number Model
Part Image ICS570BLFT Integrated Device Technology Inc

PLL Based Clock Driver, 570 Series, 2 True Output(s), 0 Inverted Output(s), CMOS, PDSO8

Part Image ICS570BLF Integrated Device Technology Inc

PLL Based Clock Driver, 570 Series, 2 True Output(s), 0 Inverted Output(s), CMOS, PDSO8

Part Image 570BIT Integrated Device Technology Inc

PLL Based Clock Driver, 570 Series, 2 True Output(s), 0 Inverted Output(s), CMOS, PDSO8

Part Image ICS570M Integrated Device Technology Inc

PLL Based Clock Driver, 570 Series, 2 True Output(s), 0 Inverted Output(s), CMOS, PDSO8

Part Image ICS570BLFT Renesas Electronics Corporation

PLL Based Clock Driver, 570 Series, 2 True Output(s), 0 Inverted Output(s), CMOS, PDSO8

For a full list of alternate parts for 570BILFT, check out Findchips.com