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5962-8980501CA - Analog Devices

Description: Data Acquisition ADCs/DACs - Specialized RMS/DC CONVERTER IC

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5962-8980501CA - Analog Devices - PCB symbol
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5962-8980501CA - Analog Devices PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - 14-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP] (D-14)
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5962-8980501CA Details

  • Manufacturer Part Number:

    5962-8980501CA

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    DIP

  • Package Description:

    CERAMIC, DIP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    D-14

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Converter Type:

    RMS TO DC CONVERTER

  • JESD-30 Code:

    R-CDIP-T14

  • JESD-609 Code:

    e0

  • Length:

    17.78 mm

  • Linearity Error-Max (EL):

    0.02%

  • Negative Supply Voltage-Nom:

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Frequency-Max:

    0.09 MHz

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP14,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Positive Input Voltage-Max:

    7 V

  • Qualification Status:

    Qualified

  • Screening Level:

    MIL-STD-883

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Total Error-Max:

    0.5%

  • Width:

    7.62 mm

5962-8980501CA Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a star-grounding configuration to minimize noise.
  • Use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device. Avoid operating the device in high-temperature environments or with high-power dissipation.
  • Exceeding maximum ratings can lead to permanent damage, reduced lifespan, or unreliable operation. Ensure that the device operates within the specified voltage, current, and temperature ranges to maintain reliability and performance.
  • Use a systematic approach to troubleshoot: check power supply and voltage levels, verify correct pin connections, and use oscilloscopes or logic analyzers to monitor signals. Consult the datasheet and application notes for guidance.
  • Yes, follow proper PCB layout and shielding techniques to minimize EMI. Use a metal shield or screen to enclose the device, and ensure good grounding and decoupling to reduce electromagnetic interference.

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5962-8980501CA Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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