Component Search Engine - Free access to schematic symbols, PCB footprints and 3D models

6376610-2 - TE Connectivity

Description: Body Features: Primary Product Color Black | Configuration Features: Number of Positions 80 | PCB Mount Orientation Vertical | Board-to-Board Configuration Parallel | Contact Features: Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness 11.81 MICIN | Contact Underplating Material Thickness 31.49 MICIN | Contact Type Pin | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .3 MICM | Contact Underplat

ECAD model is currently unavailable for this part

Note! To download footprints and symbols, use the build and request forms below

Build this Model Build

Package Category Launch Build Wizard

Request this Model (48 hours)

6376610-2 Overview

No models are available for download for 6376610-2. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.

To find more CAD model downloads similar to this part, try a partial part number search, like 63766, or try a keyword search, such as Headers and Edge Type Connectors

Parts related to 6376610-2

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →

6376610-2 - TE Connectivity

Build this Model Build

Request this Model (48 hours)

Datasheet PDF Preview

6376610-2 Overview

Parts related to 6376610-2

Select Package Category

Quick Jump

Package Categories

Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

Moulded Non-Polarised

Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

Small Outline Diode

SON

SOT

Transistor Outline, Vertical

Other