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6651903-1 - TE Connectivity

Description: Contact Features: Contact Retention Within Housing With | Contact Mating Area Plating Material Gold Flash | Contact Mating Area Plating Material Thickness 10 MICIN | Contact Mating Area Plating Material Thickness .254 MICM | Contact Current Rating (Max) 75 AMP | Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Mating Pin Diameter .142 INCH | Contact Type Socket | Contact Underplating Material Thickness 1.27 MICM | Contact Underplating Material Thickness 50 MICIN | Mating Pin Diame

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6651903-1 - TE Connectivity

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

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Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

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