Part Image

66564-1 - TE Connectivity

Description: Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Precious Metal | Wire Contact Termination Area Plating Material Gold | Contact Underplating Material Thickness 50 MICIN | Contact Retention Within Housing With | Barrel Type Open | Contact Underplating Material Nickel | Contact Base Material Brass | Contact Orientation Straight | Mating Pin Diameter 1.58 MM | Contact Size Size 16 | Contact Current Rating (Max) 7.5 AMP | Contact Underplating Mater

ECAD model is currently unavailable for this part
Note! To download footprints and symbols, use the build and request forms below

Build this Model

Launch Build Wizard
Build Wizard not available for this package category!
or

Request this Model (48 hours)

Datasheet PDF Preview

66564-1 Overview

No models are available for download for 66564-1. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 66564, or try a keyword search, such as Assembly Items

Parts related to 66564-1

Showing 0 results

Select Package Category

Package Categories