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70T3509MS133BPG - Renesas Electronics

Description: The 70T3509M is a high-speed 1024K x 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70T3509M can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V.

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70T3509MS133BPG - Renesas Electronics PCB footprint - BGA - BGA - BPG256
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70T3509MS133BPG - Renesas Electronics - 3D model - BGA - BPG256
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70T3509MS133BPG Details

  • Manufacturer Part Number:

    70T3509MS133BPG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CABGA

  • Pin Count:

    256

  • Manufacturer Package Code:

    BPG256

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    15 ns

  • Additional Feature:

    FLOW-THROUGH OR PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    133 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Memory Density:

    37748736 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    256

  • Number of Words:

    1048576 words

  • Number of Words Code:

    1000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    1MX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Standby Current-Max:

    0.06 A

  • Standby Voltage-Min:

    2.4 V

  • Supply Current-Max:

    1.12 mA

  • Supply Voltage-Max (Vsup):

    2.6 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

70T3509MS133BPG Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide and thermal design guide for the 70T3509MS133BPG, which includes recommendations for PCB layout, thermal vias, and heat sink design. It's essential to follow these guidelines to ensure optimal performance, reliability, and thermal management.
  • Renesas provides a fault detection and protection application note for the 70T3509MS133BPG, which includes guidelines for implementing overcurrent protection, overvoltage protection, and thermal protection. Additionally, the device has built-in protection features such as overcurrent detection and thermal shutdown.
  • Renesas provides a power management guide for the 70T3509MS133BPG, which includes recommended settings for the internal regulators, power modes, and power management features. It's essential to follow these guidelines to ensure optimal power efficiency and performance.
  • Renesas provides an application note for optimizing the 70T3509MS133BPG's performance, which includes guidelines for selecting the optimal clock frequency, configuring the memory interface, and optimizing power consumption. Additionally, Renesas offers a software development kit (SDK) and evaluation boards to help optimize performance for specific applications.
  • Renesas provides compatibility and interoperability information for the 70T3509MS133BPG in the datasheet and application notes. Additionally, Renesas offers a compatibility matrix and interoperability guides for specific components and systems. It's essential to review these resources to ensure compatibility and interoperability with other components and systems.

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70T3509MS133BPG Overview

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70T3509MS133BPG Alternates

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Part Image 70T3509M133BPG Renesas Electronics Corporation

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Part Image 70T3509MS133BPG Integrated Device Technology Inc

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Part Image IDT70T3509MS133BPG Renesas Electronics Corporation

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Part Image 70T3509MS133BP Renesas Electronics Corporation

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