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70T633S10BCGI - Renesas Electronics

Description: The 70T633 is a high-speed 512K x 18 Asynchronous Dual-Port Static RAM designed to be used as a stand-alone Dual-Port RAM or as a combination MASTER/ SLAVE Dual-Port RAM for 36-bit-or-more word system which would result in full-speed, error-free operation without the need for additional discrete logic. An automatic power down feature controlled by the chip enables (either CE0 or CE1) permit the on-chip circuitry of each port to enter a very low standby power mode.

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70T633S10BCGI - Renesas Electronics - PCB symbol
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70T633S10BCGI - Renesas Electronics PCB footprint - BGA - BGA - BC256
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70T633S10BCGI - Renesas Electronics - 3D model - BGA - BC256
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70T633S10BCGI Details

  • Manufacturer Part Number:

    70T633S10BCGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CABGA

  • Pin Count:

    256

  • Manufacturer Package Code:

    BCG256

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.B.2.A

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    10 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Memory Density:

    9437184 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    256

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX18

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Standby Current-Max:

    0.02 A

  • Standby Voltage-Min:

    2.4 V

  • Supply Current-Max:

    0.445 mA

  • Supply Voltage-Max (Vsup):

    2.6 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

70T633S10BCGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • Renesas recommends using an external overcurrent protection circuit, such as a current sense resistor and a comparator, to detect overcurrent conditions. The datasheet provides guidelines for selecting the current sense resistor value and setting the overcurrent threshold.
  • According to Renesas, the maximum allowed voltage on the VCC pin during power-up and power-down sequences is 6.5V. Exceeding this voltage may damage the device.
  • Renesas provides EMC guidelines in their application notes, which include recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference (EMI) and ensure compliance with relevant EMC standards.
  • The recommended operating temperature range for the 70T633S10BCGI is -40°C to 125°C. Operating the device outside this range may affect its performance, reliability, and lifespan.

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70T633S10BCGI Alternates

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Part Image IDT70T633S10BCI Renesas Electronics Corporation

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