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70T633S10BCI8 - Renesas Electronics

Description: The 70T633 is a high-speed 512K x 18 Asynchronous Dual-Port Static RAM designed to be used as a stand-alone Dual-Port RAM or as a combination MASTER/ SLAVE Dual-Port RAM for 36-bit-or-more word system which would result in full-speed, error-free operation without the need for additional discrete logic. An automatic power down feature controlled by the chip enables (either CE0 or CE1) permit the on-chip circuitry of each port to enter a very low standby power mode.

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70T633S10BCI8 - Renesas Electronics PCB footprint - BGA - BGA - BC256
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70T633S10BCI8 - Renesas Electronics  - 3D model - BGA - BC256
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70T633S10BCI8 Details

  • Manufacturer Part Number:

    70T633S10BCI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Pin Count:

    256

  • Manufacturer Package Code:

    BC256

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    10 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • Length:

    17 mm

  • Memory Density:

    9437184 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    256

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX18

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Standby Current-Max:

    0.02 A

  • Standby Voltage-Min:

    2.4 V

  • Supply Current-Max:

    0.445 mA

  • Supply Voltage-Max (Vsup):

    2.6 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    17 mm

70T633S10BCI8 Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide and thermal design guidelines in their application notes and design resources. It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • Renesas recommends using a high-quality voltage regulator with low noise and high PSRR. Decoupling capacitors should be placed close to the device, and noise reduction techniques like filtering and shielding should be employed to minimize electromagnetic interference.
  • The 70T633S10BCI8 requires a high-quality clock signal with low jitter and noise. Renesas recommends using a clock signal with a frequency tolerance of ±100 ppm and a signal amplitude of 1.8V ±10%. Clock signal integrity can be ensured by using a clock buffer, proper PCB layout, and signal termination.
  • Renesas provides a secure boot process guide and software development kit (SDK) for the 70T633S10BCI8. Engineers should follow the guide to implement the secure boot process, which involves generating and verifying digital signatures, and using the SDK to create and manage secure boot images.
  • Renesas provides a range of debugging and troubleshooting tools, including the E1 emulator, the CubeSuite+ development environment, and the Renesas Debug Tool. Engineers should use these tools to debug and troubleshoot the device, and follow best practices like using print statements, breakpoints, and signal tracing to identify and resolve issues.

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70T633S10BCI8 Overview

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Part Image IDT70T633S10BCGI Renesas Electronics Corporation

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Part Image IDT70T633S10BCI8 Renesas Electronics Corporation

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Part Image IDT70T633S10BCI Renesas Electronics Corporation

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