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70V261L25PFGI8 - Renesas Electronics

Description: The 70V261 is a high-speed 16K x 16 Dual-Port Static RAM designed to be used as a stand-alone Dual-Port RAM or as a combination MASTER/SLAVE Dual-Port RAM for 32-bit or wider memory system applications resulting in full speed, error-free operation without the need for additional discrete logic. An automatic power down feature controlled by CE permits the on-chip circuitry of each port to enter a very low standby power mode.

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70V261L25PFGI8 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - 100-Pin TQFP-ren1
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70V261L25PFGI8 - Renesas Electronics  - 3D model - Quad Flat Packages - 100-Pin TQFP-ren1
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70V261L25PFGI8 Details

  • Manufacturer Part Number:

    70V261L25PFGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PNG100

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Access Time-Max:

    25 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Memory Density:

    262144 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    100

  • Number of Words:

    16384 words

  • Number of Words Code:

    16000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16KX16

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.003 A

  • Standby Voltage-Min:

    3 V

  • Supply Current-Max:

    0.185 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

70V261L25PFGI8 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 70V261L25PFGI8 is -40°C to +85°C.
  • The power-up and power-down sequences for the 70V261L25PFGI8 should be handled according to the recommended power-up and power-down sequences outlined in the datasheet, which involves ramping up the power supply voltage and clock signals in a specific order.
  • The specific timing requirements for the 70V261L25PFGI8's clock inputs are outlined in the datasheet and include requirements for clock frequency, clock duty cycle, and clock skew.
  • The 70V261L25PFGI8's JTAG interface can be implemented using a JTAG controller and following the IEEE 1149.1 standard, with the specific pin connections and signal requirements outlined in the datasheet.
  • The specific requirements for the 70V261L25PFGI8's power supply decoupling include using a combination of ceramic and electrolytic capacitors, with values and placement guidelines outlined in the datasheet.

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