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70V3579S5BCGI - Renesas Electronics

Description: The 70V3579 is a high-speed 32K × 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70V3579 can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 3.3V.

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70V3579S5BCGI - Renesas Electronics PCB footprint - BGA - BGA - _BC256
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70V3579S5BCGI - Renesas Electronics  - 3D model - BGA - _BC256
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70V3579S5BCGI Details

  • Manufacturer Part Number:

    70V3579S5BCGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CABGA

  • Pin Count:

    256

  • Manufacturer Package Code:

    BCG256

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.B.2.A

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Access Time-Max:

    5 ns

  • Additional Feature:

    PIPELINED OUTPUT MODE, SELF TIMED WRITE CYCLE

  • Clock Frequency-Max (fCLK):

    100 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Memory Density:

    1179648 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    256

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Standby Voltage-Min:

    3.15 V

  • Supply Current-Max:

    0.415 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

70V3579S5BCGI Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 70V3579S5BCGI is -40°C to 85°C.
  • The power-up sequence for the 70V3579S5BCGI should follow the recommended sequence in the datasheet, which is VCC, then VTT, and finally CLK. This ensures proper initialization and prevents damage to the device.
  • The maximum clock frequency supported by the 70V3579S5BCGI is 133 MHz.
  • To implement clock domain crossing (CDC) with the 70V3579S5BCGI, use a synchronizer circuit or a FIFO-based CDC to ensure data integrity and prevent metastability issues.
  • The recommended termination scheme for the 70V3579S5BCGI is to use a 50-ohm termination resistor on the output pins to ensure signal integrity and prevent reflections.

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