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71V547S100PFGI - Renesas Electronics

Description: The 71V547 3.3V CMOS SRAM is organized as 128K x 36 bits. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus it has been given the name ZBTTM, or Zero Bus Turn-around. The 71V547 contains address, data-in and control signal registers. The outputs are flow-through (no output data register). In the burst mode, it can provide four cycles of data for a single address presented to the SRAM.

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71V547S100PFGI - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PKG100
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71V547S100PFGI - Renesas Electronics  - 3D model - Quad Flat Packages - PKG100
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71V547S100PFGI Details

  • Manufacturer Part Number:

    71V547S100PFGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PKG100

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    5 ns

  • Additional Feature:

    FLOW-THROUGH

  • Clock Frequency-Max (fCLK):

    66 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PQFP-F100

  • JESD-609 Code:

    e3

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    ZBT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFF

  • Package Equivalence Code:

    QFP100,.63X.87

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Standby Current-Max:

    0.045 A

  • Standby Voltage-Min:

    3.14 V

  • Supply Current-Max:

    0.21 mA

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

71V547S100PFGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (AP-6413) for the 71V547S100PFGI. It suggests using a 4-layer PCB with a solid ground plane, placing the device near the center of the board, and using thermal vias to improve heat dissipation.
  • To ensure reliable operation in high-temperature environments, it's essential to follow Renesas' guidelines for thermal management. This includes using a heat sink, ensuring good airflow, and keeping the junction temperature (Tj) below the maximum rating of 150°C. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The input capacitors should be selected based on the specific application requirements. Renesas recommends using low-ESR capacitors with a minimum capacitance of 10uF and a voltage rating of at least 2.5V. The capacitors should be placed as close as possible to the device's power pins to minimize inductance and ensure stable operation.
  • To troubleshoot issues with the clock signal, first verify that the clock input is within the specified frequency range (25MHz to 100MHz). Check the clock signal quality using an oscilloscope, ensuring it meets the specified jitter and rise/fall time requirements. If issues persist, consult Renesas' application notes and technical support resources for further guidance.
  • While the 71V547S100PFGI is available in a PBGA package, using a different package type (e.g., QFN) may affect the device's thermal performance, power consumption, and signal integrity. Consult Renesas' package-specific documentation and application notes to ensure the selected package meets the design requirements.

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71V547S100PFGI Overview

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