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71V67703S85BQG - Renesas Electronics

Description: The 71V67703 3.3V CMOS SRAM is organized as 256K x 36. The 71V67703 SRAM contains write, data, address and control registers. There are no registers in the data output path (flow-through architecture). The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.

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71V67703S85BQG - Renesas Electronics PCB footprint - BGA - BGA - 165f bga
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71V67703S85BQG - Renesas Electronics  - 3D model - BGA - 165f bga
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71V67703S85BQG Details

  • Manufacturer Part Number:

    71V67703S85BQG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Pin Count:

    165

  • Manufacturer Package Code:

    BQG165

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    8.5 ns

  • Additional Feature:

    FLOW-THROUGH ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    87 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PBGA-B165

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Memory Density:

    9437184 bit

  • Memory IC Type:

    CACHE SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    165

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    256KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Equivalence Code:

    BGA165,11X15,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.05 A

  • Standby Voltage-Min:

    3.14 V

  • Supply Current-Max:

    0.19 mA

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    13 mm

Trust Checks

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Manufacturer Collaborated
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71V67703S85BQG Overview

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Part Image 71V67703S85BQG Integrated Device Technology Inc

Cache SRAM, 256KX36, 8.5ns, CMOS, PBGA165

Part Image IDT71V67703S85BQI Integrated Device Technology Inc

Cache SRAM, 256KX36, 8.5ns, CMOS, PBGA165

Part Image IDT71V67703S85BQGI Renesas Electronics Corporation

Cache SRAM, 256KX36, 8.5ns, CMOS, PBGA165

Part Image IDT71V67703S85BQI Renesas Electronics Corporation

Cache SRAM, 256KX36, 8.5ns, CMOS, PBGA165

Part Image IDT71V67703S85BQG Renesas Electronics Corporation

Cache SRAM, 256KX36, 8.5ns, CMOS, PBGA165

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