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72V04L25JGI - Renesas Electronics

Description: IC FIFO ASYNC 4KX9 25NS 32PLCC

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PCB Footprints
72V04L25JGI - Renesas Electronics PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - plg32
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3D Models
72V04L25JGI - Renesas Electronics  - 3D model - Plastic Leaded Chip Carrier - plg32
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72V04L25JGI Details

  • Manufacturer Part Number:

    72V04L25JGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PLCC

  • Pin Count:

    32

  • Manufacturer Package Code:

    PLG32

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Access Time-Max:

    25 ns

  • Additional Feature:

    RETRANSMIT

  • Cycle Time:

    35 ns

  • JESD-30 Code:

    R-PQCC-J32

  • JESD-609 Code:

    e3

  • Length:

    13.97 mm

  • Memory Density:

    36864 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Words:

    4096 words

  • Number of Words Code:

    4000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4KX9

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.55 mm

  • Supply Current-Max:

    0.06 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11.43 mm

72V04L25JGI Frequently Asked Questions (FAQs)

  • Renesas recommends a thermal pad on the bottom of the package, connected to a copper plane on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the thermal plane.
  • Renesas recommends following the recommended operating temperature range (-40°C to 125°C) and ensuring proper thermal design, including heat sinks and thermal interfaces, to maintain a safe junction temperature.
  • The 72V04L25JGI has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. A minimum of 2kV human body model (HBM) and 200V machine model (MM) ESD protection is recommended.
  • Yes, the 72V04L25JGI is AEC-Q100 qualified, making it suitable for automotive applications. However, it's essential to follow the recommended operating conditions, and ensure compliance with relevant automotive standards and regulations.
  • Renesas recommends a soldering profile with a peak temperature of 260°C, a dwell time above 240°C of 30-60 seconds, and a total process time of 3-5 minutes. It's essential to follow the recommended soldering profile to prevent damage to the device.

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