The recommended land pattern for the 82223C can be found in Murata's application notes or by contacting their technical support. A general guideline is to follow the IPC-7351 standard for QFN packages.
The thermal pad on the 82223C should be connected to a solid ground plane to ensure proper heat dissipation. A thermal via or a thermal pad connection to the ground plane is recommended.
The maximum operating temperature range for the 82223C is -40°C to 125°C. However, it's essential to check the derating curves in the datasheet to ensure the device operates within the recommended specifications.
The 82223C is designed to withstand moderate vibration levels. However, for high-vibration environments, it's recommended to consult with Murata's technical support to determine the suitability of the device for the specific application.
To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the datasheet. It's also essential to use a soldering iron with a temperature control and a solder with a melting point compatible with the device's requirements.
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82223C Overview
Use the download button to access the 82223C 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About Murata Electronics
Murata Manufacturing Co., Ltd. is a Japanese multinational company that specializes in the design, manufacturing, and sale of electronic components and solutions.
Murata offers a wide range of electronic components and modules that are used in various industries and applications. Some of their key product categories include: capacitors, inductors, resistors, sensors, rf components and modules, and power devices.
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