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83905AGLFT - Renesas Electronics

Description: The 83905 is a low skew, 1-to-6 LVCMOS / LVTTL Fanout Buffer. The low impedance LVCMOS/LVTTL outputs are designed to drive 50Ω series or parallel terminated transmission lines. The effective fanout can be increased from 6 to 12 by utilizing the ability of the outputs to drive two series terminated lines. The 83905 is characterized at full 3.3V, 2.5V, and 1.8V, mixed 3.3V/2.5V, 3.3V/1.8V and 2.5V/1.8V output operating supply mode. Guaranteed output and part-to-part skew characteristics along with the 1.8V ou

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83905AGLFT - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 16Lead TSSOP-ren1
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83905AGLFT - Renesas Electronics  - 3D model - Small Outline Packages - 16Lead TSSOP-ren1
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83905AGLFT Details

  • Manufacturer Part Number:

    83905AGLFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Pin Count:

    16

  • Manufacturer Package Code:

    PGG16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 2.5 V SUPPLY

  • Family:

    83905

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.001 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    6

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    10 mA

  • Same Edge Skew-Max (tskwd):

    0.08 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • fmax-Min:

    100 MHz

83905AGLFT Frequently Asked Questions (FAQs)

  • Renesas recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the power planes.
  • Renesas recommends using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K between the device and the heat sink. Ensure the heat sink is properly attached and the system is designed to operate within the specified temperature range.
  • Renesas recommends using 10-22 uF decoupling capacitors with an ESR of 0.1-1 ohm, placed as close as possible to the device's power pins. Use a capacitor with a voltage rating of at least 2x the maximum operating voltage.
  • Renesas recommends using a human body model (HBM) ESD protection device with a minimum rating of 2 kV. Ensure the ESD protection device is placed as close as possible to the device's input pins.
  • Renesas recommends setting the internal regulators to the default values specified in the datasheet. For custom settings, consult the application note or contact Renesas support for guidance.

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