83947AYI-147LFT footprint, schematic symbol and 3D model by Renesas Electronics

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83947AYI-147LFT Details

Renesas recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the power planes.
Renesas recommends using a heat sink with a thermal resistance of 10°C/W or lower, and ensuring good airflow around the device. Additionally, consider using a thermal interface material with a thermal conductivity of 1 W/m-K or higher.
Renesas recommends using a low-ESR ceramic capacitor with a capacitance of 10 μF or higher, and a voltage rating of 10 V or higher. The capacitor should be placed as close as possible to the VIN pin.
Renesas recommends using a Pi-filter configuration with a 10 μF capacitor and a 10 μH inductor. The output filter should be placed as close as possible to the output pins.
Renesas recommends using a low-ESR ceramic capacitor with a capacitance of 1 μF or higher, and a voltage rating of 10 V or higher. The capacitor should be placed as close as possible to the BST pin.

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