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843011AGLF - Renesas Electronics

Description: The 843011 is a Fibre Channel Clock Generator. The 843011 uses a 26.5625MHz crystal to synthesize 106.25MHz or a 25MHz crystal to synthesize 100MHz. The 843011 has excellent <1ps phase jitter performance, over the 637kHz – 10MHz integration range. The 843011 is packaged in a small 8-pin TSSOP, making it ideal for use in systems with limited board space.

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843011AGLF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - G SUFFIX FOR 8 LEAD TSSOP_a
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843011AGLF - Renesas Electronics  - 3D model - Small Outline Packages - G SUFFIX FOR 8 LEAD TSSOP_a
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843011AGLF Details

  • Manufacturer Part Number:

    843011AGLF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Pin Count:

    8

  • Manufacturer Package Code:

    PGG8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Clock Frequency-Max:

    113.33 MHz

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Peak Reflow Temperature (Cel):

    260

  • Primary Clock/Crystal Frequency-Nom:

    26.5625 MHz

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    93 mA

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

  • uPs/uCs/Peripheral ICs Type:

    CLOCK GENERATOR, OTHER

843011AGLF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN2732EU0100) which includes thermal design considerations, such as thermal vias, copper pours, and component placement.
  • Renesas recommends a specific power sequencing scheme in their application note (R01AN2732EU0100) to ensure proper device operation. The sequence involves powering up the VCC, then the VDD, and finally the AVCC.
  • Renesas provides guidelines for EMI and noise reduction in their application note (R01AN2732EU0100), including the use of decoupling capacitors, ferrite beads, and shielding to minimize electromagnetic interference.
  • Renesas recommends using their debugging tools, such as the E1 emulator, to troubleshoot issues. Additionally, checking the device's status registers, monitoring the power supply, and verifying the PCB layout can help identify the root cause of the problem.
  • Renesas provides thermal management guidelines in their application note (R01AN2732EU0100), including the use of heat sinks, thermal interfaces, and thermal design considerations to ensure reliable operation in high-temperature environments.

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843011AGLF Overview

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