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8523AGI-03LN - Renesas Electronics

Description: The 8523I-03 is a low skew, high performance 1-to-4 Differential-to-LVHSTL fanout buffer. The 8523I-03 has two selectable clock inputs. The input pairs can accept most standard differential input levels. The clock enable is internally synchronized to eliminate runt pulses on the outputs during asynchronous assertion/deassertion of the clock enable pin. Guaranteed output and part-to-part skew characteristics make the 8523I-03 ideal for those applications demanding well defined performance and repeatability.

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8523AGI-03LN - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - (20-pin TSSOP, 173 mil Bod
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8523AGI-03LN - Renesas Electronics  - 3D model - Small Outline Packages - (20-pin TSSOP, 173 mil Bod
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8523AGI-03LN Details

  • Manufacturer Part Number:

    8523AGI-03LN

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    PGG20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • JESD-609 Code:

    e3

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    TIN

8523AGI-03LN Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN3601EU0100) which includes thermal design considerations, such as keeping the thermal pad connected to a solid ground plane and using thermal vias to dissipate heat.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and implement thermal management techniques such as reducing power consumption, using thermal interface materials, and providing adequate airflow.
  • The input capacitor (CIN) should be a low-ESR ceramic capacitor with a value between 1-10uF, and the output capacitor (COUT) should be a low-ESR ceramic capacitor with a value between 10-22uF. The capacitors should be placed close to the IC and have a low inductance path to the IC pins.
  • To troubleshoot issues, start by verifying the input voltage, output voltage, and current consumption. Check the PCB layout for any thermal design issues, and ensure that the input and output capacitors meet the recommended specifications. Use an oscilloscope to monitor the output voltage and current waveforms, and consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Yes, to minimize EMI/EMC issues, follow the recommended PCB layout guidelines, use a shielded enclosure, and ensure that the input and output cables are properly shielded and routed. Additionally, consider using EMI filters or common-mode chokes on the input and output lines.

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8523AGI-03LN Overview

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