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8533AG-01LFT - Renesas Electronics

Description: The 8533-01 is a low skew, high performance 1-to-4 Differential-to-3.3V LVPECL Fanout Buffer. The 8533- 01 has two selectable clock inputs. The CLK, nCLK pair can accept most standard differential input levels. The PCLK, nPCLK pair can accept LVPECL, CML, or SSTL input levels. The clock enable is internally synchronized to eliminate runt pulses on the outputs during asynchronous assertion/deassertion of the clock enable pin. Guaranteed output and part-to-part skew characteristics make the 8533-01 ideal for

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8533AG-01LFT - Renesas Electronics - PCB symbol
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8533AG-01LFT - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - G Suffix for 20 Lead TSSOP
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8533AG-01LFT - Renesas Electronics - 3D model - Small Outline Packages - G Suffix for 20 Lead TSSOP
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8533AG-01LFT Details

  • Manufacturer Part Number:

    8533AG-01LFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    PGG20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Family:

    8533

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    1.4 ns

  • Propagation Delay (tpd):

    1.4 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.03 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • fmax-Min:

    650 MHz

8533AG-01LFT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust power-on reset circuit, ensure a stable power supply, and consider using a thermistor or thermocouple to monitor temperature. Also, follow the recommended operating conditions and derating guidelines.
  • Use a shielded enclosure, keep sensitive traces away from the device, and implement a common-mode choke or ferrite bead on the power lines. Also, ensure a solid ground plane and decouple the power supply with capacitors.
  • Use the device's low-power modes, optimize the clock frequency, and minimize the number of active peripherals. Also, consider using a power gating technique and a low-dropout regulator (LDO) for voltage regulation.
  • Perform environmental testing (temperature, humidity, vibration), electrical testing (signal integrity, power supply), and functional testing (firmware, software). Also, consider using a failure modes and effects analysis (FMEA) to identify potential failure points.

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8533AG-01LFT Overview

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