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853S111BKILF - Renesas Electronics

Description: The 853S111BI is a low skew, high performance 1-to-10 Differential-to-2.5V/ 3.3V LVPECL/ECL Fanout Buffer. The 853S111BI is characterized to operate from either a 2.5V or a 3.3V power supply. Guaranteed output and part-to-part skew characteristics make the 853S111BI ideal for those clock distribution applications demanding well defined performance and repeatability.

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853S111BKILF - Renesas Electronics - PCB symbol
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PCB Footprints
853S111BKILF - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 32-lead VFQFN, Lead Free
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853S111BKILF - Renesas Electronics - 3D model - Quad Flat No-Lead - 32-lead VFQFN, Lead Free
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853S111BKILF Details

  • Manufacturer Part Number:

    853S111BKILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    32

  • Manufacturer Package Code:

    NLG32P1

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Family:

    853S

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of True Outputs:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.645 ns

  • Propagation Delay (tpd):

    0.61 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.8 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • fmax-Min:

    2500 MHz

853S111BKILF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APL-AN-114) which includes thermal design considerations, such as thermal vias, copper pours, and component placement.
  • Renesas recommends following their thermal design guidelines, using a heat sink if necessary, and ensuring proper airflow around the device. Additionally, the device has built-in thermal protection features, such as thermal shutdown and over-temperature detection.
  • Renesas recommends using a low-ESR ceramic capacitor (X5R or X7R dielectric) for CIN, with a value between 4.7uF to 10uF. For COUT, a low-ESR ceramic or polymer capacitor with a value between 10uF to 22uF is recommended. The specific values depend on the application's requirements and should be determined through simulation and testing.
  • Renesas recommends using the device's power-saving features, such as the low-power mode (LPM) and dynamic voltage scaling (DVS). Additionally, optimizing the system's clock frequency, using a low-power oscillator, and minimizing the number of active circuits can help reduce power consumption.
  • Renesas recommends a VIN range of 2.7V to 5.5V, and a VOUT range of 0.8V to 3.3V. The specific voltage ranges depend on the application's requirements and should be determined through simulation and testing.

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853S111BKILF Overview

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