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8543BGILF - Renesas Electronics

Description: The 8543I is a low skew, high performance 1-to-4 Differential-to-LVDS Clock Fanout Buffer. Utilizing Low Voltage Differential Signaling (LVDS) the 8543I provides a low power, low noise, solution for distributing clock signals over controlled impedances of 100Ω. The 8543I has two selectable clock inputs. The CLK, nCLK pair can accept most standard differential input levels. The PCLK, nPCLK pair can accept LVPECL, CML, or SSTL input levels. The clock enable is internally synchronized to eliminate runt pulses

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8543BGILF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PGG20
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8543BGILF - Renesas Electronics  - 3D model - Small Outline Packages - PGG20
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8543BGILF Details

  • Manufacturer Part Number:

    8543BGILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    PGG20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2020-01-14

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    8543

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    2.6 ns

  • Propagation Delay (tpd):

    2.6 ns

  • Same Edge Skew-Max (tskwd):

    0.04 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • fmax-Min:

    650 MHz

8543BGILF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated ground plane and thermal vias is recommended for optimal thermal performance. Ensure that the thermal pad is connected to a solid ground plane to dissipate heat efficiently.
  • Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow management. Ensure that the device is operated within the recommended temperature range and consider using thermal monitoring and shutdown mechanisms.
  • Power-up sequence: VCC, then AVCC, then input signals. Power-down sequence: input signals, then AVCC, then VCC. Ensure that VCC and AVCC are powered up and down simultaneously to prevent latch-up.
  • Use a multi-layer PCB with a solid ground plane, and ensure that high-frequency signals are routed away from sensitive analog circuits. Implement EMI filtering, such as ferrite beads or common-mode chokes, on the power and signal lines.
  • Use 0.1uF to 1uF decoupling capacitors, placed as close as possible to the device's power pins. Ensure that the capacitors are connected between the power pins and the ground plane.

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8543BGILF Overview

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