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8543BGLF - Renesas Electronics

Description: The 8543 is a low skew, high performance 1-to-4 Differential-to-LVDS Clock Fanout Buffer. Utilizing Low Voltage Differential Signaling (LVDS) the 8543 provides a low power, low noise, solution for distributing clock signals over controlled impedances of 100?. The 8543 has two selectable clock inputs. The CLK, nCLK pair can accept most standard differential input levels. The PCLK, nPCLK pair can accept LVPECL, CML, or SSTL input levels. The clock enable is internally synchronized to eliminate runt pulses on

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8543BGLF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PGG20*1
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8543BGLF - Renesas Electronics  - 3D model - Small Outline Packages - PGG20*1
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8543BGLF Details

  • Manufacturer Part Number:

    8543BGLF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    PGG20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    2 Days

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    8543

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    2.6 ns

  • Propagation Delay (tpd):

    2.6 ns

  • Same Edge Skew-Max (tskwd):

    0.04 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • fmax-Min:

    800 MHz

8543BGLF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots.
  • Critical timing parameters include clock frequency, clock duty cycle, and setup/hold times. Refer to the datasheet for specific values and ensure your design meets these requirements.
  • Follow the recommended power-up and power-down sequences in the datasheet. Ensure a slow voltage ramp-up (typically 1-2 ms) and a controlled ramp-down to prevent damage.
  • Use 0.1 μF to 1 μF decoupling capacitors with a voltage rating of 10-20% higher than the device's operating voltage. Place them as close to the device as possible, with a maximum distance of 1 cm.

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