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854S712AKILF - Renesas Electronics

Description: The 854S712I is a differential, high-speed 1:2 data/clock fanout buffer and line driver. The outputs support pre-emphasis in order to drive backplanes and long transmission lines while reducing inter-symbol interference effects. The pre-emphasis level is configurable to optimize for low bit error rate or power consumption. Pre-emphasis utilizes an increased output voltage swing for transition bits. The device is optimized for data rates up to 4.5 Gbps (NRZ) and for deterministic jitter in data applications

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854S712AKILF - Renesas Electronics - PCB symbol
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PCB Footprints
854S712AKILF - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NLG16P2_-1
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3D Models
854S712AKILF - Renesas Electronics - 3D model - Quad Flat No-Lead - NLG16P2_-1
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854S712AKILF Details

  • Manufacturer Part Number:

    854S712AKILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    16

  • Manufacturer Package Code:

    NLG16P2

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Family:

    854S

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.5 ns

  • Propagation Delay (tpd):

    0.5 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.01 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    3 mm

  • fmax-Min:

    3000 MHz

854S712AKILF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, heat sink recommendations, and PCB layer stack-up suggestions to ensure optimal thermal performance.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. This information can be found in the device's user manual or application notes. Typically, the sequence involves powering up the core voltage (VCC) before the input/output voltage (VIO).
  • Renesas recommends using high-quality, low-ESR decoupling capacitors with a value of 0.1 μF to 1 μF, placed as close as possible to the device's power pins. The exact capacitor values and placement can be found in the device's datasheet or application notes.
  • Renesas provides guidelines for JTAG interface handling during production testing in their device-specific documentation. This may include recommendations for JTAG pin termination, signal integrity, and testing procedures to ensure reliable device programming and testing.
  • Renesas provides thermal design guidelines and thermal models (e.g., JEDEC JESD51-7) to help designers estimate the device's junction temperature and ensure reliable operation in high-temperature environments. These resources can be found on the Renesas website or in the device's datasheet.

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854S712AKILF Overview

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