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859S0424BGILF - Renesas Electronics

Description: The 859S0424I is a 4:4 Differential-to-LVPECL/ LVDS Clock Multiplexer which can operate up to 3GHz. The outputs for this device can either be programmed to give LVPECL or LVDS levels. The 859S0424I has four selectable differential PCLKx, nPCLKx clock inputs. The PCLKx, nPCLKx input pairs can accept LVPECL, LVDS or CML levels. The fully differential architecture and low propagation delay make it ideal for use in clock distribution circuits.

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859S0424BGILF - Renesas Electronics - PCB symbol
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PCB Footprints
859S0424BGILF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PGG24*-1
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859S0424BGILF - Renesas Electronics - 3D model - Small Outline Packages - PGG24*-1
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859S0424BGILF Details

  • Manufacturer Part Number:

    859S0424BGILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    PGG24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 3.3V SUPPLY

  • Family:

    859S

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    72 mA

  • Prop. Delay@Nom-Sup:

    0.8 ns

  • Propagation Delay (tpd):

    0.8 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.025 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • fmax-Min:

    3000 MHz

859S0424BGILF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, heat sink recommendations, and PCB layer stack-up suggestions to ensure optimal thermal performance.
  • The 859S0424BGILF has a built-in overcurrent protection feature, but it's not enabled by default. To implement overcurrent protection, you need to connect an external resistor (Roc) between the OCSET pin and GND, and set the overcurrent threshold accordingly. Refer to the datasheet for the calculation formula and recommended values.
  • Although the datasheet specifies a maximum operating voltage of 5.5V, the VIN pin can tolerate up to 6.5V during startup, but only for a short duration (typically <100ms). Exceeding this voltage or duration may cause damage to the device.
  • The 859S0424BGILF is rated for operation up to 105°C, but it's essential to consider the device's power dissipation, PCB thermal design, and surrounding environment to ensure reliable operation. Renesas provides thermal derating guidelines in their datasheet and application notes to help with high-temperature designs.
  • Renesas provides a troubleshooting guide in their application notes, which covers common issues, such as output voltage regulation, overcurrent protection, and thermal shutdown. Additionally, you can use Renesas' development boards and evaluation tools to help debug and validate your design.

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859S0424BGILF Overview

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