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859S0424BGILFT - Renesas Electronics

Description: The 859S0424I is a 4:4 Differential-to-LVPECL/ LVDS Clock Multiplexer which can operate up to 3GHz. The outputs for this device can either be programmed to give LVPECL or LVDS levels. The 859S0424I has four selectable differential PCLKx, nPCLKx clock inputs. The PCLKx, nPCLKx input pairs can accept LVPECL, LVDS or CML levels. The fully differential architecture and low propagation delay make it ideal for use in clock distribution circuits.

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859S0424BGILFT - Renesas Electronics - PCB symbol
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PCB Footprints
859S0424BGILFT - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PGG24*-1
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859S0424BGILFT - Renesas Electronics - 3D model - Small Outline Packages - PGG24*-1
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859S0424BGILFT Details

  • Manufacturer Part Number:

    859S0424BGILFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    PGG24

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 3.3V SUPPLY

  • Family:

    859S

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    72 mA

  • Prop. Delay@Nom-Sup:

    0.8 ns

  • Propagation Delay (tpd):

    0.8 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.025 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • fmax-Min:

    3000 MHz

859S0424BGILFT Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, heat sink recommendations, and PCB layer stack-up suggestions to ensure optimal thermal performance.
  • The 859S0424BGILFT has an internal overcurrent protection feature, but it's recommended to add external overcurrent protection circuitry to ensure reliable operation. A simple solution is to use a current sense resistor and a comparator to detect overcurrent conditions and trigger a shutdown or warning signal.
  • The recommended power-up sequence is to apply the power supply voltage (VCC) first, followed by the input voltage (VIN). This ensures that the internal voltage regulators and bias circuits are properly initialized before the device becomes active.
  • To troubleshoot I2C interface issues, use a logic analyzer or oscilloscope to monitor the SCL and SDA lines. Check for proper signal levels, rise and fall times, and ensure that the I2C bus is not overloaded. Also, verify that the I2C address is correctly set and that there are no conflicts with other devices on the bus.
  • The maximum operating temperature range for the 859S0424BGILFT is -40°C to +125°C, as specified in the datasheet. However, it's essential to consider the device's thermal derating and ensure that the junction temperature (TJ) does not exceed the recommended maximum value.

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859S0424BGILFT Overview

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859S0424BGILFT Alternates

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