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86434-1 - TE Connectivity

Description: Contact Features: Contact Orientation Horizontal | PCB Contact Termination Area Plating Material Thickness 79 MICIN | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Thickness 2.0066 MICM | Contact Mating Area Plating Material Thickness 79 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.0066 MICM | Contact Type Socket | Dimensions:

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86434-1 - TE Connectivity

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86434-1 Overview

Parts related to 86434-1

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Aluminium Electrolytic Capacitor

Axial Diameter Horizontal Mount

BGA

Chip Array

Chip Non-Polarised

Chip Polarised

Connector

Dual-In-Line Sockets

Header, Receptacle

Header, Shrouded

Header, Unshrouded

Moulded Non-Polarised

Moulded Polarised

QFN

QFP-PLCC

Radial Diameter

SIL-MIL

Small Outline Diode

SON

SOT

Transistor Outline, Vertical

Other