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8714008DKILF - Renesas Electronics

Description: The 8714008I is Zero-Delay Buffer/Frequency Multiplier with eight differential HCSL output pairs, and uses external feedback (differential feedback input and output pairs) for "zero delay" clock regeneration. In PCI Express® and Ethernet applications, 100MHz and 125MHz are the most commonly used reference clock frequencies and each of the eight output pairs can be independently set for either 100MHz or 125MHz. With an output frequency range of 98MHz to 165MHz, the device is also suitable for use in a variet

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8714008DKILF - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 56 Lead VFQFN4
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8714008DKILF - Renesas Electronics  - 3D model - Quad Flat No-Lead - 56 Lead VFQFN4
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8714008DKILF Details

  • Manufacturer Part Number:

    8714008DKILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    VFQFPN

  • Package Description:

    VFQFN-56

  • Pin Count:

    56

  • Manufacturer Package Code:

    NLG56P3

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    8714008

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-XQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    210 mA

  • Same Edge Skew-Max (tskwd):

    0.21 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    8 mm

  • fmax-Min:

    165 MHz

8714008DKILF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APL-AN-1201) which includes thermal design considerations, such as thermal vias, copper pours, and component placement, to ensure optimal thermal performance.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. This involves powering up the VCC pin first, followed by the VDD pin, and then the AVCC pin. A detailed power sequencing diagram is available in the datasheet.
  • Renesas recommends using high-frequency, low-ESR decoupling capacitors (e.g., 100nF, 1uF, and 10uF) placed close to the device's power pins to minimize noise and ensure stable operation.
  • Renesas provides a JTAG interface for debugging and testing purposes. During production testing, it's recommended to use a JTAG adapter or a boundary scan tool to access the device's internal registers and perform testing. Renesas also provides a JTAG programming guide for reference.
  • Renesas recommends following the thermal design guidelines outlined in the datasheet, including using thermal interfaces, heat sinks, and thermal vias to dissipate heat. Additionally, the device's thermal shutdown feature can be enabled to prevent overheating in high-temperature environments.

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