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89H12NT12G2ZCHLG - Renesas Electronics

Description: Provides 12 PCIe Gen2 lanes and 12 ports of high-performance, deterministic system interconnect switching. All ports receive full line rate, non-blocking throughput for multiple traffic flows regardless of switch loading.

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89H12NT12G2ZCHLG - Renesas Electronics PCB footprint - BGA - BGA - HLG324
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89H12NT12G2ZCHLG - Renesas Electronics  - 3D model - BGA - HLG324
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89H12NT12G2ZCHLG Details

  • Manufacturer Part Number:

    89H12NT12G2ZCHLG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FCBGA

  • Package Description:

    FCBGA-324

  • Pin Count:

    324

  • Manufacturer Package Code:

    HLG324

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 100 MHZ

  • Bus Compatibility:

    I2C; ISA; SMBUS; VGA

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    12000 MBps

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA324,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.88 mm

  • Supply Current-Max:

    3300 mA

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89H12NT12G2ZCHLG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a 1.6 mm PCB thickness for optimal thermal performance.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots. Monitor junction temperature and adjust the system design accordingly.
  • Power-on sequence: VCC, then VDD, then AVCC. Power-off sequence: AVCC, then VDD, then VCC. Ensure a minimum of 10 ms delay between power-on and power-off sequences.
  • Implement ESD protection devices, such as TVS diodes or ESD arrays, on all external interfaces. Ensure a minimum of 2 kV HBM and 100 V MM protection.
  • Use 0.1 μF and 10 μF decoupling capacitors, placed as close as possible to the power pins. Ensure a minimum of 10 nF capacitance per power pin.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

89H12NT12G2ZCHLG Overview

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