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89H12NT12G2ZCHLG8 - Renesas Electronics

Description: Provides 12 PCIe Gen2 lanes and 12 ports of high-performance, deterministic system interconnect switching. All ports receive full line rate, non-blocking throughput for multiple traffic flows regardless of switch loading.

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89H12NT12G2ZCHLG8 - Renesas Electronics - PCB symbol
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89H12NT12G2ZCHLG8 - Renesas Electronics PCB footprint - BGA - BGA - HLG324
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89H12NT12G2ZCHLG8 - Renesas Electronics - 3D model - BGA - HLG324
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89H12NT12G2ZCHLG8 Details

  • Manufacturer Part Number:

    89H12NT12G2ZCHLG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FCBGA

  • Package Description:

    BGA-324

  • Pin Count:

    324

  • Manufacturer Package Code:

    HLG324

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    12000 MBps

  • Drive Interface Standard:

    1200

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.88 mm

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89H12NT12G2ZCHLG8 Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide and thermal design guidelines in their application notes and design resources. It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • Renesas recommends using a low-dropout regulator (LDO) with a high power supply rejection ratio (PSRR) to minimize noise and voltage fluctuations. Additionally, decoupling capacitors should be placed close to the MCU's power pins to reduce noise and improve stability.
  • Renesas provides a secure boot mechanism and firmware update guidelines in their documentation. It's essential to follow these guidelines to ensure secure boot and firmware updates, including using secure communication protocols, encrypting firmware images, and implementing secure key management.
  • Renesas provides a range of development tools, including debuggers, emulators, and software development kits (SDKs). Engineers can use these tools to debug and troubleshoot issues, as well as consult Renesas' documentation and application notes for guidance on low-level hardware interactions.
  • Renesas provides thermal derating factors and guidelines in their datasheet and application notes. Engineers should ensure that the MCU operates within the recommended temperature range and follow thermal design guidelines to prevent overheating and ensure reliable operation.

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89H12NT12G2ZCHLG8 Overview

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