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89H12NT12G2ZCHLGI8 - Renesas Electronics

Description: Provides 12 PCIe Gen2 lanes and 12 ports of high-performance, deterministic system interconnect switching. All ports receive full line rate, non-blocking throughput for multiple traffic flows regardless of switch loading.

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89H12NT12G2ZCHLGI8 - Renesas Electronics - PCB symbol
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89H12NT12G2ZCHLGI8 - Renesas Electronics PCB footprint - BGA - BGA - HLG324
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89H12NT12G2ZCHLGI8 - Renesas Electronics - 3D model - BGA - HLG324
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89H12NT12G2ZCHLGI8 Details

  • Manufacturer Part Number:

    89H12NT12G2ZCHLGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FCBGA

  • Package Description:

    BGA-324

  • Pin Count:

    324

  • Manufacturer Package Code:

    HLG324

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    12000 MBps

  • Drive Interface Standard:

    1200

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.88 mm

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89H12NT12G2ZCHLGI8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (AP61101) for the 89H12NT12G2ZCHLGI8, which includes thermal design considerations and layout recommendations for optimal heat dissipation.
  • Renesas recommends following the thermal design guidelines and ensuring that the device is operated within the specified temperature range (TJ = -40°C to 150°C). Additionally, using a heat sink and thermal interface material can help to reduce the junction temperature and ensure reliable operation.
  • Renesas recommends using X7R or X5R ceramic capacitors with a voltage rating of 10V or higher for the input and output capacitors. The capacitance value should be selected based on the specific application requirements, but a typical value is 10uF to 22uF.
  • Renesas provides a troubleshooting guide in their application note (AP61101) that covers common issues with the internal regulator, such as output voltage deviations, oscillations, and overcurrent protection. The guide provides step-by-step procedures for identifying and resolving these issues.
  • Renesas recommends following the JEDEC standard J-STD-020D for soldering conditions, which specifies a peak temperature of 260°C and a dwell time of 30 seconds to 60 seconds.

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89H12NT12G2ZCHLGI8 Overview

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