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89H16NT16G2ZCHLGI8 - Renesas Electronics

Description: Provides 16 PCIe Gen2 lanes and 16 ports of high-performance, deterministic system interconnect switching. All ports receive full line rate, non-blocking throughput for multiple traffic flows regardless of switch loading.

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89H16NT16G2ZCHLGI8 - Renesas Electronics PCB footprint - BGA - BGA - HLG324
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89H16NT16G2ZCHLGI8 - Renesas Electronics  - 3D model - BGA - HLG324
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89H16NT16G2ZCHLGI8 Details

  • Manufacturer Part Number:

    89H16NT16G2ZCHLGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FCBGA

  • Package Description:

    FCBGA-324

  • Pin Count:

    324

  • Manufacturer Package Code:

    HLG324

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    16000 MBps

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.63 mm

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89H16NT16G2ZCHLGI8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (AP6111) for the 89H16NT16G2ZCHLGI8, which includes thermal design considerations, such as thermal vias, copper pours, and component placement.
  • To ensure reliable operation in high-temperature environments, it's essential to follow Renesas' guidelines for thermal management, including proper heat sink design, thermal interface material selection, and airflow management. Additionally, consider using thermal simulation tools to optimize the design.
  • Renesas recommends using a combination of ceramic and electrolytic capacitors for power supply decoupling, with a total capacitance of at least 10uF per power pin. Additionally, a pi-filter or LC-filter can be used to reduce noise and ripple on the power supply lines.
  • To optimize power consumption, consider using the device's power-saving modes, such as the 'Low Power Mode' or 'Sleep Mode', and adjust the clock frequency and voltage according to the application's requirements. Additionally, use power gating and clock gating techniques to reduce power consumption in idle modes.
  • Renesas provides guidelines for internal oscillator and clock generation settings in their application note (AP6111). The recommended settings include using the internal oscillator with a 12MHz crystal, and configuring the clock generation unit to produce a stable clock signal with minimal jitter.

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89H16NT16G2ZCHLGI8 Overview

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