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89HPES12T3G2ZBBCGI - Renesas Electronics

Description: Provides high-performance I/O expansion and switching functions between a PCIe upstream port and two downstream ports or peer-to-peer switching between downstream ports.

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89HPES12T3G2ZBBCGI - Renesas Electronics PCB footprint - BGA - BGA - BCG 324
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89HPES12T3G2ZBBCGI - Renesas Electronics  - 3D model - BGA - BCG 324
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89HPES12T3G2ZBBCGI Details

  • Manufacturer Part Number:

    89HPES12T3G2ZBBCGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Package Description:

    BGA-324

  • Pin Count:

    324

  • Manufacturer Package Code:

    BCG324

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 100 MHZ

  • Bus Compatibility:

    PCI, SMBUS

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    12000 MBps

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA324,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.72 mm

  • Supply Current-Max:

    781 mA

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89HPES12T3G2ZBBCGI Frequently Asked Questions (FAQs)

  • Renesas recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
  • Renesas recommends using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K between the device and the heat sink. Ensure the heat sink is properly secured to the device.
  • Renesas recommends powering up the device in the following sequence: VCC, then VCCIO, and finally VREF. Ensure a minimum delay of 10 ms between each power-up step.
  • Renesas recommends using a human body model (HBM) ESD protection circuit with a minimum of 2 kV rating. Ensure the ESD protection circuit is connected to the device's VCC pin.
  • Renesas recommends routing clock signals as differential pairs, with a maximum length of 10 inches (25 cm) and a maximum skew of 100 ps. Use a 50-ohm transmission line with a minimum of 2 layers of ground planes.

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89HPES12T3G2ZBBCGI Overview

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