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89HPES8T5AZBBCG - Renesas Electronics

Description: Provides high-performance I/O expansion and switching functions between a PCIe upstream port and four downstream ports or peer-to-peer switching between downstream ports.

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89HPES8T5AZBBCG - Renesas Electronics PCB footprint - BGA - BGA - BGA 15.0 X 15.0  X 1.0 MM PIT
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89HPES8T5AZBBCG - Renesas Electronics  - 3D model - BGA - BGA 15.0 X 15.0  X 1.0 MM PIT
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89HPES8T5AZBBCG Details

  • Manufacturer Part Number:

    89HPES8T5AZBBCG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Package Description:

    BGA-196

  • Pin Count:

    196

  • Manufacturer Package Code:

    BCG196

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    SMBUS

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    3000 MBps

  • JESD-30 Code:

    S-PBGA-B196

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    196

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA196,14X14,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.76 mm

  • Supply Current-Max:

    495 mA

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89HPES8T5AZBBCG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, heat sink recommendations, and PCB layer stack-up suggestions to ensure optimal thermal performance.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. This information can be found in the device's user manual or application notes. Typically, the sequence involves powering up the VCCIO and VCC cores in a specific order, followed by the VREF and VDDQ rails.
  • The recommended JTAG interface settings can be found in the device's user manual or datasheet. Typically, the settings include the JTAG clock frequency, voltage levels, and signal termination. Renesas also provides a JTAG interface specification document that outlines the recommended settings.
  • To optimize the 89HPES8T5AZBBCG for low power consumption, Renesas recommends using their Power Management (PM) features, such as dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, optimizing the system's clock tree, using low-power modes, and minimizing I/O activity can also help reduce power consumption.
  • The 89HPES8T5AZBBCG's BIST feature has limitations, such as testing only a subset of the device's functionality, and may not cover all possible failure modes. Additionally, BIST may not be able to detect certain types of faults, such as those related to external components or system-level issues. Renesas provides more information on the BIST feature's limitations in their user manual or application notes.

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89HPES8T5AZBBCG Overview

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