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8L30210NLGI - Renesas Electronics

Description: The 8L30210 is a low skew, 1-to-10 LVCMOS / LVTTL Fanout Buffer. The low impedance LVCMOS/LVTTL outputs are designed to drive 50Ω series or parallel terminated transmission lines. The 8L30210 is characterized at full 3.3V and 2.5V, mixed 3.3V/2.5V, 3.3V/1.8V, 3.3V/1.5V, 2.5V/1.8V and 2.5V/1.5V output operating supply modes. The input clock is selected from two differential clock inputs or a crystal input. The differential input can be wired to accept a single-ended input. The internal oscillator circuit is

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8L30210NLGI - Renesas Electronics - PCB symbol
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PCB Footprints
8L30210NLGI - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NLG 32
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8L30210NLGI - Renesas Electronics - 3D model - Quad Flat No-Lead - NLG 32
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8L30210NLGI Details

  • Manufacturer Part Number:

    8L30210NLGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    32

  • Manufacturer Package Code:

    NLG32P1

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Family:

    30210

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.0001 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of True Outputs:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    19 mA

  • Prop. Delay@Nom-Sup:

    3 ns

  • Propagation Delay (tpd):

    5 ns

  • Same Edge Skew-Max (tskwd):

    0.055 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

  • fmax-Min:

    10 MHz

8L30210NLGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (AP61101) for the 8L30210NLGI, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
  • The 8L30210NLGI has a built-in overcurrent protection feature, but it's recommended to add external overcurrent protection circuitry, such as a fuse or a current sense resistor, to provide additional protection against excessive current draw. Consult the datasheet and application notes for guidance on implementing overcurrent protection.
  • Renesas recommends a specific power-up sequence to ensure proper device operation. The sequence involves powering up the VCC pin first, followed by the VDD pin, and then the input voltage (VIN). Consult the datasheet and application notes for the recommended power-up sequence.
  • To troubleshoot I2C interface issues, check the I2C bus voltage levels, clock frequency, and signal integrity. Ensure that the I2C bus is properly terminated, and that the device is properly addressed. Consult the datasheet and application notes for I2C interface guidelines and troubleshooting tips.
  • The 8L30210NLGI has an operating temperature range of -40°C to +125°C, but the maximum junction temperature (TJ) should not exceed +150°C. Ensure that the device is properly cooled and that the thermal design meets the recommended guidelines to prevent overheating.

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