Part Image

8S89874BKILFT - Renesas Electronics

Description: The 8S89874I is a high speed 1:2 Differential-to- LVPECL Buffer/ Divider. The 8S89874I has a selectable ÷1, ÷2, ÷4, ÷8, ÷16 output divider, which allows the device to be used as either a 1:2 fanout buffer or frequency divider. The clock input has internal termination resistors, allowing it to interface with several differential signal types while minimizing the number of required external components. The device is packaged in a small, 3mm x 3mm VFQFN package, making it ideal for use on space-constrained boa

Download 8S89874BKILFT Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
8S89874BKILFT - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16 Lead VFQFN
click to zoom
3D Models
8S89874BKILFT - Renesas Electronics  - 3D model - Quad Flat No-Lead - 16 Lead VFQFN
click to zoom

8S89874BKILFT Details

  • Manufacturer Part Number:

    8S89874BKILFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    VFQFPN

  • Package Description:

    VFQFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    NLG16P2

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    8S

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    45 mA

  • Prop. Delay@Nom-Sup:

    0.84 ns

  • Propagation Delay (tpd):

    0.84 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.015 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.63 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • fmax-Min:

    2000 MHz

8S89874BKILFT Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, heat sink recommendations, and PCB layer stack-up suggestions to ensure optimal thermal performance.
  • Renesas recommends following the power sequencing guidelines outlined in their datasheet and application notes. Typically, this involves powering up the voltage regulators in a specific order to prevent damage or malfunction. A power sequencing diagram is usually provided in the datasheet or application notes.
  • Renesas recommends using high-quality, low-ESR decoupling capacitors with a value of 10uF to 22uF, and a voltage rating of 6.3V or higher. The capacitors should be placed as close as possible to the power pins of the device. Refer to the datasheet or application notes for specific recommendations.
  • Renesas provides troubleshooting guides and FAQs on their website, which cover common issues and solutions. Additionally, engineers can use oscilloscopes, logic analyzers, and other debugging tools to identify and resolve issues. Renesas also offers technical support and application notes to help with troubleshooting.
  • Renesas recommends considering thermal design factors such as junction temperature, thermal resistance, and power dissipation when designing with the 8S89874BKILFT. Engineers should ensure proper heat sinking, thermal vias, and PCB layout to prevent overheating and ensure reliable operation.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

8S89874BKILFT Overview

Use the download button to access the 8S89874BKILFT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 8S898, or try a keyword search, such as Clock Drivers

Parts related to 8S89874BKILFT

Showing 0 results

8S89874BKILFT Alternates

Showing results

Image Part Number Model
Part Image 8S89874BKILF Renesas Electronics Corporation

Low Skew Clock Driver, 8S Series, 2 True Output(s), 0 Inverted Output(s), QCC16

Part Image 8S89874BKILF/W Renesas Electronics Corporation

Low Skew Clock Driver, 8S Series, 2 True Output(s), 0 Inverted Output(s), QCC16