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8SLVD1208-33NBGI8 - Renesas Electronics

Description: The IDT8SLVD1208-33I is a high-performance differential LVDS fanout buffer. The device is designed for the fanout of high-frequency, very low additive phase-noise clock and data signals. The IDT8SLVD1208-33I is characterized to operate from a 3.3V power supply. Guaranteed output-to-output and part-to-part skew characteristics make the IDT8SLVD1208-33I ideal for those clock distribution applications demanding well-defined performance and repeatability. Two selectable differential inputs and eight low skew ou

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8SLVD1208-33NBGI8 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NBG28
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3D Models
8SLVD1208-33NBGI8 - Renesas Electronics  - 3D model - Quad Flat No-Lead - NBG28
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8SLVD1208-33NBGI8 Details

  • Manufacturer Part Number:

    8SLVD1208-33NBGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    28

  • Manufacturer Package Code:

    NBG28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    26 Weeks, 1 Day

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Family:

    8SLVD

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N28

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of True Outputs:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    190 mA

  • Prop. Delay@Nom-Sup:

    0.33 ns

  • Propagation Delay (tpd):

    0.33 ns

  • Same Edge Skew-Max (tskwd):

    0.04 ns

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

8SLVD1208-33NBGI8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes layout considerations for signal integrity, power supply, and thermal management.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. This information can be found in the device's user manual or application notes. Typically, the sequence involves powering up the core voltage (VCC) before the input/output voltage (VIO).
  • The 8SLVD1208-33NBGI8 has a thermal junction-to-case rating of 30°C/W. To ensure reliable operation, it's essential to implement proper thermal management, such as using a heat sink, thermal interface material, and ensuring good airflow around the device.
  • To minimize clock signal integrity issues and jitter, Renesas recommends using a clock signal with a low jitter budget, implementing proper signal routing and termination, and using a clock buffer or repeater if necessary. Additionally, the device's clock input should be decoupled with a capacitor to reduce noise.
  • The 8SLVD1208-33NBGI8 has built-in ESD protection, but it's still essential to follow proper handling and storage precautions to prevent damage. This includes using an anti-static wrist strap, working on an ESD-protected surface, and storing the device in an anti-static bag or container.

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