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8SLVD1208NBGI8 - Renesas Electronics

Description: The 8SLVD1208I is a high-performance differential LVDS fanout buffer. The device is designed for the fanout of high-frequency, very  low additive phase-noise clock and data signals. The 8SLVD1208I is characterized to operate from a 2.5V power supply. Guaranteed output-to-output and part-to-part skew characteristics make the 8SLVD1208I ideal for those clock distribution applications demanding well-defined performance and repeatability. Two selectable differential inputs and eight low skew outputs are availab

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PCB Footprints
8SLVD1208NBGI8 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - dfn29
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3D Models
8SLVD1208NBGI8 - Renesas Electronics  - 3D model - Quad Flat No-Lead - dfn29
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8SLVD1208NBGI8 Details

  • Manufacturer Part Number:

    8SLVD1208NBGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    VFQFPN

  • Pin Count:

    28

  • Manufacturer Package Code:

    NBG28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    3

  • Family:

    8SLVD

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N28

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of True Outputs:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    0.38 ns

  • Same Edge Skew-Max (tskwd):

    0.04 ns

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

8SLVD1208NBGI8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN1841) and design guides (e.g., DG0091). It's essential to follow these guidelines to ensure optimal performance, minimize noise, and reduce EMI.
  • The 8SLVD1208NBGI8 has a thermal pad on the bottom, which should be connected to a solid ground plane on the PCB to dissipate heat. Additionally, consider using thermal vias, heat sinks, or thermal interface materials to further reduce thermal resistance.
  • The input capacitor should be a low-ESR, high-frequency capacitor (e.g., ceramic or film capacitor) with a value between 10nF to 100nF. The capacitor should be placed as close as possible to the VIN pin and connected to a solid ground plane.
  • To ensure reliable operation, follow the recommended operating conditions, including voltage, current, and temperature ranges. Additionally, consider using temperature-compensated components, and ensure that the PCB design and layout can withstand the maximum operating temperature.
  • The recommended output voltage and current limits depend on the specific application. However, as a general guideline, set the output voltage to the desired level (e.g., 1.2V, 1.5V, or 1.8V) and limit the output current to the maximum rating (e.g., 8A) to prevent overheating and ensure reliable operation.

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8SLVD1208NBGI8 Overview

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