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954310BGLF - Renesas Electronics

Description: IDT954310 follows the Intel CK410M-compliant clock specification. This clock synthesizer provides a single chip solution for next generation P4 Intel processors and Intel chipsets. IDT954310 is driven with a 14.318MHz crystal.

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PCB Footprints
954310BGLF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 6.10 mm. Body, 0.50 mm. Pitch TSSOP
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3D Models
954310BGLF - Renesas Electronics  - 3D model - Small Outline Packages - 6.10 mm. Body, 0.50 mm. Pitch TSSOP
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954310BGLF Details

  • Manufacturer Part Number:

    954310BGLF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Pin Count:

    64

  • Manufacturer Package Code:

    PAG64

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDSO-G64

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    70 °C

  • Output Clock Frequency-Max:

    400 MHz

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP64,.32,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Primary Clock/Crystal Frequency-Nom:

    14.318 MHz

  • Qualification Status:

    Not Qualified

  • Supply Current-Max:

    400 mA

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • uPs/uCs/Peripheral ICs Type:

    CLOCK GENERATOR, PROCESSOR SPECIFIC

954310BGLF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, heat sink recommendations, and PCB layer stack-up suggestions to ensure optimal thermal performance.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. This information can be found in the device's user manual or application notes. Typically, the sequence involves powering up the voltage rails in a specific order, with a delay between each rail to prevent latch-up or other issues.
  • Renesas provides guidelines for decoupling capacitor selection in their application notes or user manuals. The recommended capacitors typically include a combination of ceramic and electrolytic capacitors with specific values and placement recommendations to ensure proper power supply noise filtering and decoupling.
  • Renesas provides troubleshooting guides and FAQs on their website, which cover common issues and their solutions. Additionally, engineers can use debugging tools, such as logic analyzers or oscilloscopes, to identify the root cause of the issue. It's also recommended to review the device's errata sheet for any known issues or workarounds.
  • Renesas provides thermal design guidelines and thermal models (e.g., JEDEC JESD51-7) for the 954310BGLF, which can be used to estimate the device's junction temperature. Engineers should consider factors such as airflow, heat sink design, and PCB thermal conductivity to ensure the device operates within its specified temperature range.

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954310BGLF Overview

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