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9DB1233AGLF - Renesas Electronics

Description: The 9DB1233 zero-delay buffer supports PCIe Gen3 requirements, while being backwards compatible to PCIe Gen2 and Gen1. The 9DB1233 is driven by a differential SRC output pair from an IDT 932S421 or 932SQ420 or equivalent main clock generator. It attenuates jitter on the input clock and has a selectable PLL bandwidth to maximize performance in systems with or without Spread-Spectrum clocking.

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9DB1233AGLF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PAG64
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9DB1233AGLF Details

  • Manufacturer Part Number:

    9DB1233AGLF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    PAG64

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    9DB

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    R-PDSO-G64

  • JESD-609 Code:

    e3

  • Length:

    17 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Number of True Outputs:

    12

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP64,.32,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    325 mA

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

  • fmax-Min:

    0.1 MHz

9DB1233AGLF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the IC away from high-current paths and ensure good airflow around the device.
  • Use a soft-start circuit to limit inrush current during startup. For shutdown, ensure a controlled shutdown sequence to prevent voltage spikes and ensure all internal circuits are fully discharged.
  • Use a common-mode choke, ferrite beads, and Y-capacitors to filter out high-frequency noise. Ensure proper PCB layout and shielding to minimize radiated emissions.
  • Use the device's built-in power-saving features, such as dynamic voltage scaling and clock gating. Implement a low-power mode controller to minimize current consumption during standby.
  • Use a combination of oscilloscopes, signal generators, and multimeters to measure voltage, current, and frequency. Perform tests under various load conditions and temperatures to ensure device reliability.

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9DB1233AGLF Overview

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Part Image 9DB1233AGLF Integrated Device Technology Inc

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Part Image 9DB1233AGLFT Renesas Electronics Corporation

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