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9DBL411AGLFT - Renesas Electronics

Description: TSSOP 4.4 MM 0.65MM PITCH

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9DBL411AGLFT - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 20-pin TSSOP, 173 Mil. Narrow Body
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9DBL411AGLFT - Renesas Electronics  - 3D model - Small Outline Packages - 20-pin TSSOP, 173 Mil. Narrow Body
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9DBL411AGLFT Details

  • Manufacturer Part Number:

    9DBL411AGLFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Pin Count:

    20

  • Manufacturer Package Code:

    PGG20

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Family:

    9DBL

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    3.5 ns

  • Propagation Delay (tpd):

    3.5 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

9DBL411AGLFT Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN9834) and design guides (e.g., DG0034). It's essential to follow these guidelines to ensure optimal performance, minimize noise, and reduce EMI.
  • The 9DBL411AGLFT has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink if necessary. Follow Renesas' thermal design guidelines (e.g., AN9835) for more information.
  • The input clock signal should be a differential signal with a frequency range of 25 MHz to 200 MHz. The clock signal should have a duty cycle of 40% to 60% and a voltage swing of 200 mV to 1.4 V. Refer to the datasheet for more detailed information on clock signal requirements.
  • The 9DBL411AGLFT has various operating modes, such as PLL bypass, PLL lock, and power-down modes. These modes can be configured using the device's control pins (e.g., PLL_BYPASS, PLL_LOCK, and PDN) and registers. Refer to the datasheet and application notes for specific configuration details.
  • Renesas recommends using 0.1 μF to 1 μF decoupling capacitors for the power supply pins (VCC and GND). Place these capacitors as close as possible to the device's power supply pins to minimize noise and ensure stable operation.

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9DBL411AGLFT Overview

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