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9DML4493ANLGI - Renesas Electronics

Description: 9DML4493A is a Gen1–6 compliant 4-input, 4-output clock multiplexer.  It can also operate as a dual 2-input, 2-output clock multiplexer. It has very low additive phase jitter and is suitable for all PCIe data rates. The device supports today's complex system power sequencing requirements with Power Down Tolerant and Flexible Power Sequencing features. For information regarding evaluation boards and material, please contact your local Renesas sales representative.

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PCB Footprints
9DML4493ANLGI - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NLG32P1
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3D Models
9DML4493ANLGI - Renesas Electronics  - 3D model - Quad Flat No-Lead - NLG32P1
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9DML4493ANLGI Details

  • Manufacturer Part Number:

    9DML4493ANLGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Pin Count:

    32

  • Manufacturer Package Code:

    NLG32P1

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES AT 2.5 V AND 3.3 V POWER SUPPLY

  • Family:

    9DML

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-PQCC-N32

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE WITH SERIES RESISTOR

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    82 mA

  • Prop. Delay@Nom-Sup:

    1.6 ns

  • Propagation Delay (tpd):

    1.6 ns

  • Same Edge Skew-Max (tskwd):

    0.022 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    1.89 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

  • fmax-Min:

    100 MHz

9DML4493ANLGI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal gradients. Additionally, consider using thermal simulation tools to optimize the design.
  • A 10uF ceramic capacitor with a 10nF ceramic capacitor in parallel, placed as close to the device as possible, is recommended for decoupling. Additional capacitors may be required depending on the specific application.
  • Check the power supply voltage, ensure that the POR pin is properly connected, and verify that the reset signal is properly generated. Use an oscilloscope to monitor the POR signal and verify that it meets the specified timing requirements.
  • Operating the device at the maximum junction temperature can reduce its lifespan and affect its reliability. Ensure that the device is operated within the recommended temperature range to ensure optimal performance and reliability.

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9DML4493ANLGI Overview

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