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9ZML1253EKILF - Renesas Electronics

Description: The 9ZML1253E is a second generation enhanced performance DB1200ZL derivative. The part is a pin-compatibleupgrade to the 9ZML1232B, while offering a much improved phase jitter performance. A fixed external feedback maintains low drift for critical QPI/UPI applications, while each input channel has software adjustable input-to-output delay to ease transport delay management for today's more complex server topologies. The 9ZML1253E has an SMBus Write Lockout pin for increased device and system security.

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9ZML1253EKILF - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 72-Lead VFQFN--
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9ZML1253EKILF - Renesas Electronics  - 3D model - Quad Flat No-Lead - 72-Lead VFQFN--
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9ZML1253EKILF Details

  • Manufacturer Part Number:

    9ZML1253EKILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Package Description:

    VFQFPN-72

  • Pin Count:

    72

  • Manufacturer Package Code:

    NLG72P1

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Family:

    9ZML

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N72

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    72

  • Number of True Outputs:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC72,.39SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    10 mm

9ZML1253EKILF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN4461EJ0100) which includes thermal design considerations, such as thermal vias, copper pours, and component placement.
  • Renesas recommends following their thermal design guidelines, using a heat sink if necessary, and ensuring proper airflow around the device. Additionally, consider using a thermistor or thermal sensor to monitor the device temperature.
  • Renesas recommends using X7R or X5R ceramic capacitors with a voltage rating of 10V or higher for input and output capacitors. The capacitance value should be between 4.7uF to 10uF, and the ESR should be less than 100mΩ.
  • Check the power supply voltage, ensure the input voltage is within the recommended range, and verify the POR timing is correct. Also, check for any noise or glitches on the power supply lines that might be affecting the POR circuitry.
  • The OCP feature has a response time of around 1us, and it may not detect very short-duration overcurrent events. Additionally, the OCP threshold is typically set to 150% of the maximum rated current, and it may not protect against very high current surges.

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